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0.8W Thermal Conductive Silicone Adhesive (Customizable)

DTP1315 is a silicone-based thermal interface material, formulated with silicone resin as the matrix, filled with ceramic powder and metal oxides, and manufactured through a specialized process. It is a one-component white paste with strong adhesion, waterproof and sealing properties, and excellent mechanical strength, exhibiting good bonding performance to most metallic and non-metallic materials.

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2W TIM1 Thermal Silicone Adhesive (Customizable)

DTP2522 is a one-component semi-flowable TIM1 thermal interface material (TIM), formulated with silicone resin as the matrix, filled with ceramic powder and metal oxides, and manufactured through a specialized process.This thermal interface material achieves rapid curing when heated to 150℃, with the bonding effect improving as the heating time extends. Compared with other thermal interface materials, it offers excellent applicability, superior surface compatibility, reliable electrical insulation, and strong adhesion.

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8W Fiberglass Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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6W PI Film Backing Thermal Conductive Pad

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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4.5W Thermal Conductive Phase Change Material CPU/GPU( Customizable)

DTM8822 Thermal Phase Change Pad is a thermally conductive phase change material, formulated with special silicone resin as the matrix, incorporated with phase change paraffin powder and metal oxides, and manufactured via a specialized production process. Upon reaching the phase change temperature, the material softens and demonstrates exceptional wettability, which effectively enhances the heat transfer efficiency between heat-generating components and heat-dissipating surfaces.

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5W Fiberglass Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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Ceramifiable Silicone Tape (customizable)

DTF1345 is an insulating adhesive material composed of special glass fiber as the base material, coated with high-strength organic silicone via a special process, and laminated with single-sided adhesive tape.It features high adhesive strength and good tensile strength. Compared with other insulating adhesive materials, DTF1345 boasts excellent conformability and aging resistance, and can be used for bundling, insulation and shielding of transformers, motor coils, and positive and negative electrodes of power batteries.

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3W Thermal Grease/Thermal Paste (Customizable)

DTH0351 is a paste-type thermal interface material designed for use between high-power electronic components and heat sinks. Its excellent wettability enables it to rapidly fill micro-pores on the contact interface, significantly reducing interfacial thermal resistance.It can quickly and effectively lower the temperature of electronic components, thereby extending their service life and improving operational reliability. In addition to high thermal conductivity, the product exerts no stress during application and maintains high stability within the temperature range of -40℃ to 125℃, fully complying with the requirements of the electronics industry for paste-type thermal interface materials.

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6W One-Component Thermal Gel (customizable)

DTC6513 Thermal Conductive Gel is silicone-based, filled with various high-performance thermal conductive fillers. It features high thermal conductivity, low thermal resistance, excellent electrical insulation, and superior compressibility. Designed to cover uneven or irregular device/component/shell surfaces, it fully fills the gaps between heat-generating chips and heat sinks, enabling rapid heat dissipation.

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3.5W One-Component Thermal Gel (customizable)

DTC0351 Thermal Conductive Gel is silicone-based, filled with various high-performance thermal conductive fillers. It features high thermal conductivity, low thermal resistance, excellent electrical insulation, and superior compressibility. Designed to cover uneven or irregular device/component/shell surfaces, it fully fills the gaps between heat-generating chips and heat sinks, enabling rapid heat dissipation.

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3W Silicon Thermal Conductive Pad Single-sided adhesive backing

This thermal conductive interface material is produced through a specialized process, utilizing silicone resin as the matrix and filled with thermally conductive fillers. Compared to other thermal interface materials (TIMs), it offers higher thermal conductivity and improved mechanical strength. The product features single-sided adhesive backing for easy handling and application. It is suitable for covering uneven or irregular device surfaces, effectively filling the gap between heat-generating components and heat sinks to achieve optimal heat dissipation. We deliver tailored packaging and labeling.

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TIM1 Thermal Silicone Adhesive (Customizable)

TIM1 thermally conductive adhesive is a single-component, semi-flowing TIM1 material made by using silicone resin as the matrix, with ceramic powders and metal oxides filled, and processed through a special process. This thermal interface material can rapidly cure when heated to 150℃; the longer the heating time, the better the bonding performance. Compared to other thermal interface materials, TIM1 boasts excellent applicability and surface compatibility, superior electrical insulation, and strong adhesion. We deliver tailored packaging and labeling.

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